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Toshiba BA400 series

The Toshiba BA400 series provides reliability and robustness, combined with a powerful processor to further enhance the printers performance whilst future-proofing your investment. The BA400 series clamshell design for front-loading ensures smooth drop-in media loading, suitable for versatile applications. The BA410 with its metal case is suited for rugged manufacturing environments, whereas the BA420 with its small footprint and plastic case suits workplaces where space is a premium, such as offices or retail shops.

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Description

Key Specifications

BA410 GS/TS BA420 GS/TS
Printing Method Thermal transfer / direct thermal Thermal transfer/ direct thermal
Print Head Type/Alignment Flat head; Centred Flat head; Centred
Resolution 8 dots/mm (203 dpi), optional 11.8 dots/mm (300 dpi)
Interface USB 2.0 HS, Ethernet 10/100 Base T (IPv4 & IPv6), Bluetooth V2.1 EDR with MFi certified, NFC (for Bluetooth pairing). Options - WLAN 802.11a/b/g/n (dual band for 2.4 GHz/5 GHz)),parallel port), serial port), expansion I/O) USB 2.0 HS, Ethernet 10/100 Base T (IPv4 & IPv6), Bluetooth V2.1 EDR with MFi certified, NFC (for Bluetooth pairing). Options - WLAN 802.11a/b/g/n (dual band for 2.4 GHz/5 GHz)),parallel port), serial port), expansion I/O)
Print Width/Print Length Width: Maximum 104 mm, up to 105.7 mm with 300 dpi printhead Length: Direct thermal Batch 6-1, 498 mm Cut 14-1, 498 mm Peel-off 15-1, 496 mm Thermal transfer Batch 11-1, 498 mm Cut 14-1, 498 mm Peel-off 15-1, 496 mm Width: Maximum 104 mm, up to 105.7 mm with 300 dpi printhead Length: Direct thermal Batch 6-1, 498 mm Cut 14-1, 498 mm Peel-off 15-1, 496 mm Thermal transfer Batch 11-1, 498 mm Cut 14-1, 498 mm Peel-off 15-1, 496 mm
Print Speed 203.2 mm/second (8ips) 203.2 mm/second (8ips)
Dimensions & Weight 245 mm (W) x 414 mm (D) x 333 mm (H), 15 kg (without media and ribbon). 245 mm (W) x 350 mm (D) x 332 mm (H), 12 kg (without media and ribbon).
Standard Ribbon Lenghts 450M 450M
Emulations ZPL II, SBPL ZPL II, SBPL
Interface Options/Options Cutter module, peel-off module, serial interface board, Centronics parallel interface, wireless LAN module, UHF RFDI kit), expansion I/O board, RTC (real time clock), fanfold paper guide Cutter module, peel-off module, serial interface board, Centronics parallel interface, wireless LAN module, UHF RFDI kit), expansion I/O board, RTC (real time clock), fanfold paper guide

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